introduction :
Cool Master GKJ-003 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
features :
- Suitable for CPU, chipsets on Mainboard, VGA card, etc.
- Zif Socket Templates ensure correct applying area with various CPU socket types.
- Produces an even layer when using applicator.
- Wide range of application temperature.
excellence :
- easy to use
- dielectric
- heavily filled with heat conductive metal oxides
specification :
color : white
specific gravity : 2.38
viscosity/flowability : nonflowing
shelf life : 3 years from DOM
thermal conductivity : 0.9 watts/meter
volume resistivity : 5.0 x 1014
dielectric constant : 4.3 at 100k Hz
dissipation factor : 0.03 at 100k Hz
dielectric strenght : 551 volts/mil; 21.6 kV/mm
Tugas Kelompok
Rafika Suri
Ramadhabia Fadillah
Silvana
Siska Nurul
